Flexible circuit boards have many advantages such as space saving, weight reduction and high flexibility. The global demand for flexible circuit boards is increasing year by year. The unique characteristics of flexible circuit boards make it an alternative to rigid circuit boards and traditional wiring solutions in a variety of applications. It also drives the development of many new areas. The fastest growing part is the internal hard disk drive (HDD). The second largest area of growth in cable is the new integrated circuit package. The flexible circuit technology has great market potential in portable devices such as mobile phones.
The current flexible circuit board is mainly made of polyimide or polyester film as the substrate of the printed circuit board, which has the characteristics of high assembly density, small size, light weight, etc., and is widely used in the connection parts of current electronic products. It is currently in the stage of small but rapid development of the industry. It has good electrical performance and can meet the needs of today's miniature, high-precision installation design. It is now the material of choice for miniaturization and mobilization of electronic products. It can be easily bent, wound, folded, and bent many times. It is difficult to damage the wire. It can be freely arranged according to the space layout requirements. The integration of components and wire connections can be achieved in different spaces, which greatly reduces the electronic products. Volume and weight are powerful guarantees for high density, miniaturization and high reliability of electronic products.
With the development of flexible circuits, smaller and more complex flexible circuit boards will become the future development direction in the future. The traditional processing methods are difficult to meet the processing needs due to their own conditions, in order to achieve a more refined flexible circuit. Design requires a more refined machining solution.
Due to the current ultraviolet laser marking machine, a laser beam with high energy can convert light energy into chemical energy when it is applied to a polymer material such as PI. Under the action of a precision laser beam, a part of the atomic substance is connected. The chemical bond of the molecule changes to achieve the purpose of surface treatment.
In this process, due to the processing time period and energy concentration, the surface of the processed article is hardly damaged, which can be effectively guaranteed both in processing accuracy and quality. Although the price of the current UV laser marking machine is still more expensive than the traditional processing equipment, the marking process requirements are difficult to reach by other processing methods. It is believed that in the future, laser technology will give a more sophisticated processing solution for flexible processing, which will provide a strong guarantee for the future flexible circuit to be smaller and more complex.