UV laser marking machines engrave metal and non-metallic materials. It is more suitable for applications that require more precision and higher precision. Widely used in leather, craft gifts, fabric cutting, architectural ceramics, clothing accessories, rubber products, electronic components, glasses materials, medical packaging, food packaging, shell brand, communications equipment and other industries.
Many of the symbols we usually find in life, metal or non-metal mark letters and patterns, such as BMW logo, mobile phone buttons and so on. These patterns are marked by an ultraviolet laser marking machine. Ultraviolet laser marking machines use laser beams to permanently mark the surface of various materials. The laser light energy evaporates on the surface layer of the target material and exposes the deep layer of the material; the laser light can cause the chemical and physical changes of the surface layer material to "engraving" the desired pattern text; the laser light can burn off some of the substance, thereby showing the desired etching Patterns, texts.
While the electronics industry is developing rapidly, the cutting technology of circuit boards is also constantly innovating. The traditional processing methods can not meet the ever-changing line width and line spacing, smaller and smaller apertures, and higher flexibility. The market demand, therefore, laser processing is undoubtedly the best choice.
In the processing of PCB and FPC, UV laser cutting has the advantages of narrow slit, small thermal influence, smooth trimming, high efficiency, no mechanical stress on the trimming edge, high efficiency and environmental protection, and is an ideal improvement scheme for traditional crafts.
The UV laser has no thermal effect. The result of marking and cutting is precise and smooth. The sidewall is steep. There is no obvious thermal influence on the micrometer beside the incision. There is no thermal effect and no scorch problem, so there is no need to consider The heat it generates damages the components. The lines and solder joints near the edges are intact and burr-free. In addition, because the focus spot is extremely small, and the processing heat affected zone is minimal, it can be used for ultra-fine marking and special material marking, which is the first choice for customers with higher requirements for marking effect.