The difference between the core component lasers:
UV laser marking machine: developed by 355nm UV laser. This model uses third-order intracavity frequency doubling technology compared with infrared laser. 355 UV focusing spot is very small, which can greatly reduce the mechanical deformation of materials. And the processing heat has little effect. Fiber laser marking machine: 1064nm wavelength is used.
Regarding the laser wavelength, the shorter the general wavelength, the smaller the spot size of the laser, the higher the precision, the smaller the heat-affected zone formed during processing, and the more beautiful the processing effect.
The difference between processing methods:
The processing method of ultraviolet laser marking machine is different from other laser marking equipment. Generally, for CO2 laser marking machine and fiber laser marking machine, it is used for laser physical marking method, and ultraviolet laser marking machine. It is processed by chemical processing methods, mainly photochemical reactions. The difference between these two different processing methods is that the laser physics processing method is the main method.
If the surface of the product and material is processed, the laser chemical processing method can be processed into the interior of the product material with a laser.
Based on the working principle and processing method of the two laser marking machines, there are certain differences in the fields of application.
Differences in application areas:
The fiber laser marking machine is suitable for laser marking of various metal surfaces. Due to the heat generated by its beam, it is not suitable for high-precision special material marking. Ultraviolet laser marking machine: It is especially suitable for the high-end market of ultra-fine processing. The surface of packaging bottles for cosmetics, medicines, video and other polymer materials is marked with fine effect, the marking is clean and firm, better than ink coding and no pollution; flexible Pcb board marking, dicing; silicon wafer micro-hole, blind hole processing. Among them, 80% of the data lines on the market, the adapter marking is from the UV laser marking.