On September 13, 2018, Apple's 2018 autumn new product launch was scheduled. At this conference, Apple brought three new iPhones, Apple Watch 4 and iPhone XS/XR/XS Max. The launch of a new generation of Apple products has touched the hearts of many fruit powders and has also touched the hearts of many laser practitioners. Because Apple's products are too closely related to lasers, laser technology provides more efficient and sophisticated processing for Apple products, and Apple has also driven the rapid growth of the laser industry, which complement each other. Let's take a closer look at what laser elements are available on this new Apple product.
All three iPhones feature a full-screen design, with the iPhone XS and iPhone XS Max using 5.8-inch and 6.5-inch OLED screens respectively, and the iPhone XR with a 6.1-inch LCD screen. For the full screen profile cutting, the current best processing solution is laser cutting. Because laser cutting is non-contact processing, there is no mechanical stress damage and the efficiency is high. At the same time, because laser cutting focuses the laser onto the material, the material is locally heated until it exceeds the melting point, and then the molten metal is blown away by the high pressure gas. Therefore, as the beam and the material move, a very narrow cut can be formed. The seams are more precise and can better meet the needs of full-screen mobile phone manufacturing.
The logo, back text, battery and other parts of the iPhone use laser marking technology. Laser marking is a marking method that uses a high-energy-density laser to locally irradiate a workpiece to vaporize the surface material or cause a color change, thereby leaving a permanent mark with high precision, high speed, and clear mark. Features. The mobile phone uses laser marking, which is a permanent marking method, which can improve the anti-counterfeiting ability and increase the added value, so that the product looks higher grade and more brand-like.
There are many small holes in the iPhone, such as speakers and microphones. The traditional drilling process uses mechanical drilling. After the introduction of laser technology, the processing quality and efficiency are greatly improved, and the processing cost is reduced. At the same time, the waterproof performance claimed by the iPhone XS is also related to laser drilling. Experiments have shown that as long as the aperture is less than 2μm, the waterproof function of 10m water pressure can be realized, and the hole with a hole diameter of 2μm can not be realized by mechanical drilling, which is another stage of laser drilling technology. The laser technology has the features of maintenance-free, easy operation, non-contact processing and no consumables, which saves production costs and enables the drilling hole to be smaller and does not require subsequent processing.
PCB, FPC board processing
Laser technology on PCB and FPC boards is mainly reflected in marking and drilling and cutting. Compared with PCB coding, PCB marking has the advantages of finer, more efficient, clearer and lower cost. It is of great significance in quality information control and SMT production line. Laser drilling and laser cutting of PCB and FPC boards have the advantages of higher precision and faster speed. At the same time, laser drilling can also achieve blind holes, which cannot be achieved by traditional processes.
3D sensing face recognition
Last year's iPhone X's 3D sensor fired the VSCEL laser, and this year's iPhone XS series will continue to retain this feature. Early 3D sensing systems generally use LEDs as infrared sources. However, with the maturity of VCSEL (Vertical Cavity Surface Emitting Laser) technology, the cost performance of VCSELs is close to that of infrared LEDs. In addition, VCSEL lasers have resonant cavities that allow the beams to be more concentrated and coupled. It is better in terms of accuracy, miniaturization, low power consumption, reliability, etc., and has become the mainstream light source for 3D cameras.